ISSBO 2024
Jul. 31 - Aug. 2 • Chongqing • China
Invited Speakers
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1. Liu Liu (Zhejiang University)
Title: Electro-optical devices based on silicon and lithium niobate heterogeneous integration
2. Siming Chen (HS Photonics)
Title: Quantum dot laser on silicon – Recent progress and future prospects
3. Ting Wang (Institute of Physics CAS)
Title: TBA
4. Yaocheng Shi (Zhejiang University)
Title: TBA
5. Xingchen Ji (Shanghai Jiao Tong University)
Title: Ultra Low-loss Silicon Nitride Photonic Integrated Circuits
6. Weiwei Zhang (Songshan Lake Materials Laboratory)
Title: Silicon optical modulators
7. Jiagui Wu (Southwest University)
Title: Optimal design of ultra-compact silicon-optics functional devices
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1. Jianji Dong (Huazhong University of Science and Technology)
Title: Reconfigurable photonic computing chip
2. Liangjun Lu (Shanghai Jiao Tong University)
Title: Parallel data transmission and dispersion compensation powered by soliton microcombs
3. Min Tan (Huazhong University of Science and Technology)
Title: TBA
4. Xiao Li (Phovie)
Title: Integrated Photonics for Healthcare
5. Yong Zhang (Shanghai Jiao Tong University)
Title: Integrated Pockels electro-optic modulator on silicon photonics platform
6. Xiaojun Xie (Southwest Jiaotong University)
Title: High-speed thin-film lithium niobate optical coherent receiver
7. Zhao Zhang (Institute of Semiconductors, Chinese Academy of Sciences)
Title: Recent Research Progress On the ICs Design for Optical Interconnects
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1. Ruping Cao (Luceda)
Title: Enable Large-Scale Photonic Integrated Circuit Design with Software Automation
2. Adam Lewis (CUMEC)
Title: TBA
3. Yan Cai (SITRI)
Title: Silicon/Lithium Niobate Heterogeneous Integrated Electro-Optical Modulators
4. Can Yao (Ligentec)
Title: Low loss SiN photonic integrated circuit platform and its applications
5. Zhiheng Quan (JFS Laboratory)
Title: TBA
6. Feng Qiu (Hangzhou Institute for Advanced Study, UCAS)
Title: Electro-optic Modulators Based on Organic Materials and Crystalline Thin Films
7. Hongwei Zhang (National Center for Advanced Packaging Co., Ltd.)
Title: Application of Advanced Packaging in Optoelectronic Integration
Resources
Contact us
Biying Yang (CUMEC)
Email: biying.yang@cumec.cn
Tel: 13259662008(微信同号)
Daiming Ma(Learning Conference)
Email: madaiming@learningconf.cn
Tel: 13482300288
Yini Peng(Learning Conference)
Email: pengyini@learningconf.cn
Tel: 17751312086